Malaysia on Track to Achieve 60,000 Semiconductor Talent Target by 2030

KUALA LUMPUR, 18 November 2025: Malaysia is on the right track to achieve its national goal of producing 60,000 high-skilled talents in semiconductor-related fields by 2030, Deputy Investment, Trade and Industry Minister Liew Chin Tong confirmed in the Dewan Rakyat on Monday (Nov 17). The government’s focus covers critical areas, including integrated circuit (IC) design, advanced packaging, research and development (R&D), and wafer fabrication.

Progress and Strategy

Since the launch of the National Semiconductor Strategy (NSS) in May 2024, the government has made substantial progress in building its specialized workforce:

  • Talent Trained: A total of 13,679 engineers and technical experts have already been trained, certified, and absorbed into various segments of the semiconductor industry.
  • Key Thrust: Liew Chin Tong stated that skilled talent development is a critical thrust of the NSS, ensuring the long-term competitiveness and sustainability of the industry.
  • Institutions Involved: Key Malaysian public universities and skills centers involved in this effort include Universiti Sains Malaysia (USM), Universiti Malaya (UM), Universiti Teknologi Malaysia (UTM), the Malaysian Institute of Microelectronic Systems Berhad (MIMOS), and the High Technology Training Centre (ADTEC).

Budget 2026 Incentives and Collaboration

The government is bolstering the talent pipeline with significant funding and enhanced industry-academic collaboration:

  • Training Opportunities: Budget 2026 announced three million training opportunities focused on the high-tech sector, including semiconductors, under HRD Corp.
  • Youth & TVET Programs: Khazanah’s K-Youth and TVET training programs were allocated RM200 million to provide on-the-job training for 11,000 youth without degrees in strategic sectors like semiconductors.
  • IC Design: The Flagship IC Design Programme will continue with an allocation of RM340 million to train 2,500 world-class talents in integrated circuit design.

The Deputy Minister highlighted that major multinational chipmakers are actively establishing strategic collaborations with public universities. This collaboration includes developing industry-based curriculum, providing high-tech laboratories, and engaging in joint applied research on next-generation semiconductor technologies.

Liew concluded that this comprehensive approach will solidify Malaysia’s position as a regional hub for developing world-class semiconductor human capital.

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